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Engineering expertise meets AI innovation

Component Design and Packaging AI Solutions was formed from the merger of an established engineering consultancy and an AI software company. We saw an opportunity to combine decades of physics and engineering domain knowledge with modern machine learning to build something new - a simulation platform that is faster, smarter, and more accessible than anything currently available.

We are in the early stages of building this platform. Our team is developing cloud-native simulation tools, physics-informed AI models, and autonomous engineering workflows that we believe will change how engineers approach design and validation.

To make engineering simulation faster, more accessible, and AI-native - so every engineer can explore more, prototype less, and build better.

We combine AI research, physics expertise, and thoughtful engineering to build simulation tools that solve real problems. No complexity for its own sake. Just tools that help engineers make better decisions, faster.

Meet the Team

The people building the future of AI-native engineering simulation.

Sarah Mitchell
CEO & Founder

Over 20 years of leadership across engineering, enterprise technology, and simulation. Previously held senior roles at two ASX-listed firms before founding Component Design and Packaging AI Solutions.

James Chen
Chief Technology Officer

Leads platform architecture and cloud infrastructure. Deep background in distributed systems, high-performance computing, and scalable simulation deployment.

Priya Sharma
Head of AI

Oversees AI research and physics-informed model development. Specialist in surrogate modelling, scientific machine learning, and simulation acceleration. PhD in computational physics from the University of Melbourne.

Join Our Early Access Programme

We are building in the open and looking for engineering teams who want to shape the platform with us.

Request Early Access